 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| r07ds0891ej0001 rev.0.01 page 1 of 17 nov 29, 2012 preliminary datasheet raa207700gbm/7701gbm/7702GBM synchronous buck regulator with internal power mosfets description the raa207700gbm is monolithic synchronous buck regulator with power mosfets in extremely small package. the raa207700gbm delivers high output current by small rds(on) power mosfets. constant on time control architecture provides fast transient response, and minimize external components. the raa207700gbm operates skip mode at light load, it provides high efficiency in all load condition. three current ability products can be selected. features ? wide input voltage range: 3 v to 16 v ? constant-on-time control ? built-in power mosfets suitable for pc, server application ? very low stand-by current: 0.1 ? a (typ.) ? very low quiescent current :320 ? a (typ. at no load) ? switching frequency: adjustable up to 2 mhz ? high average output current, up to 15 a (7700gbm), 10 a (7701gbm), 5 a (7702GBM) ? controllable driver: remote on/off ? power good function ? over current protection/over voltage protection/thermal shutdown function ? built-in bootstrapping diode ? soft start period adjustable ? enhanced light load mode function for higher efficiency ? high drivability built-in line switch driv er for low-loss line switch driving ? extremely small chip size package with solder bump ? pb-free/halogen-free application circuit vcin on/off pgood sgnd vin sw pgnd boot vin raa207700gbm raa207701gbm raa207702GBM ss ls_in vout_1 vcin set fb ls_out line sw control signal discrete line sw vout_2 r07ds0891ej0001 rev.0.01 nov 29, 2012
raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 2 of 17 nov 29, 2012 pin arrangement top view vcin sw sw sw sw sw boot vin vin vin sgnd set sw pgo od sw sw sw sw ss on/ off fb vin vin ls_ out ls_ in vcin boot sgnd set pgo od ss on/ off fb ls_ out ls_ in vcin boot sgnd set pgo od ss on/ off fb ls_ out ls_ in a a a 12345 12345 12345 g f e d c b f e d c b d c b pgnd pgnd pgnd pgnd pgnd pgnd pgnd pgnd pgnd pgnd sw sw sw sw vin vin vin sw sw sw sw sw sw sw sw sw vin vin vin vin vin pgnd pgnd pgnd pgnd pgnd pgnd pgnd pgnd pgnd raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 3 of 17 nov 29, 2012 pin description pin name pin no. description remarks vcin 1a controller input voltage (+ 5 v input) controller supply input sgnd 2a controller analog gnd should be connected to pgnd on pcb pattern fb 3a feedback voltage input pin ls_in 4a line sw driver control pin ls_out 5a line sw driver output pin boot 1b bootstrap voltage pin to be supplied +5 v through integrated sbd set 2b constant on time program pin tie resistor between sw and set pgood 3b power good indicator pin pull low when no good (open drai n output) ss 4b soft start period program pin tie capacitor between ss and sgnd on/off 5b operation enable pin oper ation stop when l signal asserted vin ? input voltage sw ? switching node pgnd ? power ground should be connected to sgnd on pcb pattern note: pin assign of 1a-5a & 1b-5b is common thro ugh raa207700gbm, raa207701gbm and raa207702GBM. raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 4 of 17 nov 29, 2012 block diagram vcin boot vin sw pgnd sgnd on/off fb ovp pgood 0.8 v 1.0 v ss 1m vcin zcd comparator ls_in vin ls_out 2.5 a enable ovp ocp tsd set enable fault fault zcd enable tsd tsd uvlo uvlo ovp ripple comparator control logic uvlo 1m + fault ? + tsd uvlo 4.3 v ? + ? + 0.72 v ? + 1 shot timer delay protection function ocp 1. truth table for the on/off pin 2. truth table for line switch driver on/off input driver chip status ls_in input ls_out status "l" shutdown (operation stop) "l" gnd "open" shutdown (operat ion stop) "open" gnd "h" enable (normal operation) "h" vin raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 5 of 17 nov 29, 2012 absolute maximum ratings (ta = 25c) item symbol ratings unit notes input voltage vin ?0.3 to +20 v 1 switch node voltage sw 20(dc), 23(<10 ns) v 1 boot voltage vboot 25(dc), 28(<10 ns) v 1, 2 controller voltage vcin ?0.3 to +6 v 1 input pin voltage (fb, ls_in) v input ?0.3 to vcin +0.3 v 1, 3 on/off voltage v on/off ?0.3 to vin v 1 set voltage v set ?0.3 to vin v 1 pgood voltage v pgood ?0.3 to vin v 1 pgood sink current i pgood +2 ma 4 operating junction temperatur e tj-opr ?40 to +125 c storage temperature tstg ?55 to +150 c notes: 1. rated voltages are relative to voltages on the sgnd and pgnd pins. 2. boot ? vcin < 20 v 3. vcin + 0.3 v < 6 v 4. for rated current, (+) i ndicates inflow to the chip. recommended operating condition item symbol ratings unit remarks input voltage vin 3 to 16 v controller voltage vcin 4.5 to 5.5 v continuous output current iout 0 to 15 0 to 10 0 to 5 a 15 a: raa207700gbm 10 a: raa207701gbm 5 a: raa207702GBM raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 6 of 17 nov 29, 2012 electrical characteristics (ta = 25c, vcin = 5 v, vin = 12 v, sw = 0 v, unless otherwise specified) item symbol min typ max unit test conditions vcin start threshold vh ? 4.3 4.5 v vcin shutdown threshold in ccm vl 3.6 3.8 ? v vcin shutdown threshold in ell mode v lccm ? 3.0 3.6 v in ell mode (dcm, f sw < 100 khz) vcin operating current (raa207700gbm) i cin ? 40 ? ma vcin operating current (raa207701gbm) i cin ? 35 ? ma vcin operating current (raa207702GBM) i cin ? 20 ? ma f sw = 1 mhz, ton = 200 ns vcin quiescent current iq ? 320 400 ? a output = no load, ell mode vcin disable current i cin-disbl ? 0.1 5 ? a on/off = 0 v, ls_in = 0 v supply vin disable current i in-disbl ? 0.1 5 ? a on/off = 0 v, ls_in = 0 v disable level v disbl ? ? 0.6 v 3.3 / 5.0 v interface enable level v enbl 2.0 ? ? v 3.3 / 5.0 v interface remote on/off pull-down resistance r disbl 0.7 1 1.3 m ? on/off = 1 v line sw off level v lsin_off ? ? 0.6 v 3.3 / 5.0 v interface line sw on level v lsin_on 2.0 ? ? v 3.3 / 5.0 v interface line_sw input pull-down resistance r ls_in 0.7 1 1.3 m ? ls_in = 1 v line sw on output voltage v lsw_on vin?0.5 vin ? v ls_in = 5 v line sw off output voltage v lsw_off ? ? 0.1 v ls_in = 0 v line sw on source current i lsw_source ? 25 ? ma vin = 12 v, ls_in = 5 v line sw off sink current i lsw_sink ? 25 ? ma vin = 12 v, ls_in = 0 v line sw on propagation delay t plswon ? 300 ? ns lsin to lsout rising line sw off propagation delay t plswoff ? 300 ? ns lsin to lsout falling line_sw output line sw drive current of vin i in-ls ? 8 20 ? a ls_in = 5 v comparator threshold voltage v fb_comp 792 800 808 mv fb fb input current i fb_in ?0.1 0 +0.1 ? a fb = 1 v rising threshold on fb v pg_rise 0.67 0.72 0.77 v power good hysteresis dv pg ? 50 ? mv power good indicator power good resistance r pg 0.25 0.5 1 k ? fb = 0 v soft start soft start bias current i ss 1.8 2.5 3.2 ? a over voltage protection ovp trip voltage on fb v ovp 0.95 1.00 1.05 v ocp trip current (raa207700gbm) i ocp 16.0 20.0 24.0 a fixed internally * 1 ocp trip current (raa207701gbm) i ocp 12.0 15.0 18.0 a fixed internally * 1 over current protection ocp trip current (raa207702GBM) i ocp 6.4 8.0 9.6 a fixed internally * 1 tsd trip temperature t tsd 130 150 ? c * 1 over temperature protection temperature hysteresis t hys ? 30 ? c * 1 note: * 1 not directly tested. assured by related characteristics test. raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 7 of 17 nov 29, 2012 description of operation the raa207700gbm operates as voltage-ripple based constant on time control architecture. converter output is controlled by output voltage ripple which is determined by inductor ripple current and es r & esl of output capacitor. each switching cycle starts high-side mosfet turn on which time is decided by 1 shot timer. after high-side mosfet turns off, low side turns on, and it keeps until fb voltage becomes lower than reference voltage. in light load condition, low-side mosfet on time is decided by inductor zero current. switching frequency, constant on time setting sw set rset switching frequency in ccm mode is determined by following equation. switching frequency: (vout/vin) ? (1/ton) [hz] here, ton is high-side mos on time, and it is determined by following equation. on time pulse: (50 pf ? 1 v / vi n ? 2.0 v) ? rset + 50 ns [s] from above equation, constant on time is change depend on vin, so switching frequency is almost constant when vin change. this architecture is suitable for battery application. from the above equation, rset is calculated by rset: (vout / (vin ? fsw) ? 50 ns) ? (vin ? 2.0 v) / (50 pf ? 1 v) [ ? ] 100 300 500 700 900 1100 1300 1500 1700 0 50 100 150 200 250 rset [k] on time [ns] vin = 12 v vin = 5 v on time [ns] 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 4 6 8 10121416 vin [v] rset = 30 k raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 8 of 17 nov 29, 2012 maximum duty cycle operation maximum duty cycle is restricted by following equation. max. duty: 1 ? (50 ns ? fsw) here, fsw is switc hing frequency. if fb voltage does not reach reference voltage after th e high-side mosfet turn on time is expired, low-side mosfet turns on 50 ns, and next switching cycle starts. esp ecially, this condition occurs when output load transient state. sw il (inductor current) 50 ns soft start ss sgnd css soft start ramp period is adjustable by external capac itor (css) selection. when converter start operating, 2 ? a current from ss pin charges capacitor between ss and gnd. soft start period is determined by following equation. soft start period: css ? 0.8 v / 2.5 ? a [s] here, 0.8 v is internal reference voltage vref. ic operates diode emulation mode at soft start period, so it can prevent from reverse current when pre-bias condition. soft start rest arts when enable signal re-e ntered, and after ocp, ovp, tsd, uvl release condition. power good indicator power good indicator is useful for controlling multi-converter systems for sequential start up and shut down. fb voltage ismonitored continuously by power good comparator. the power good comparator compares fb pin and 90% internal referencevoltage (0.72 v). when fb reaches reference voltage, pgood pin be comes high impedance after internal delay (30% of soft start period). under the fault cond ition (uvlo, ovp, ocp, tsd) , pgood pin is pulled low. 0.72 v 0.80 v soft start period power good delay (30% soft start period) ss fb vout pgood raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 9 of 17 nov 29, 2012 over voltage protection (ovp) when fb voltage exceeds 125% of reference voltage (1.0 0 v), switching stops immedi ately and latched low-side mosfet on state in order to pull the output voltage. to leave the ovp condition, vcin needs to be pulled under the uvlo level, and re-enter the signal. fb 125% vref high mosfet signal low mosfet signal on/off (uvl) pgood 90% vref delay over current protection (ocp) ocp detection circuit monitors high-side mosfet drain-source current. when the current exceeds fixed level eight time, ic starts hiccup operation. in the hiccup operation, switching stops and operate 1 ms timer. after 1 ms timer is expired, ic operates again from soft start state. if ic dete ct ocp in the soft start circuit, hiccup operation start again. sw il 0 a ocp level 1 ms wait 1 ms wait ss pgood ocp detect note: pgood pin is connected vcin through resistor. raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 10 of 17 nov 29, 2012 thermal shutdown (tsd) thermal sensor monitors junction temperature of ic. when junction temperature exceeds 150c, switching stops. after junction temperature become 125c, ic restart switching from soft start (non-latched function). enhanced light load function (ell) ic operates diode emulation mode in light load condition. to enhance light load efficiency, ic detects light load condition automatically, and operate as enhanced light load mode (ell). in ell mode, bi as current of ic becomes small, so this function can improve the efficiency. line switch driver the raa207700gbm/7701gbm/7702GBM incorporates high drivability built in line switc h driver. the line switch driver can drives large gate capacitance mo sfet with low power consumption. (typical 8 ? a at vin = 12 v) line switch driver operates independent of voltage regulator?s state. ls_out ls_in vin vin input signal 0 v - 3.3 v 0 v - vin vout1 discrete mosfet vout2 note: this function is independent of state of voltage regulator. raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 11 of 17 nov 29, 2012 stability criteria, output voltage se tting for high esr output capacitor small output ripple voltage makes control loop unstable in constant on time architecture. ripple voltage needs to be larger than 15 mv on fb pin. when using high esr (>50 m ? ) capacitor such as electro lytic capacitor, polymer aluminum capacitor for output capacitor, ripple voltage on fb pin will be more than 15 mv. sw fb vout r1 r2 cout lout vin esr stability criteria from loop stability analysis, constant on time control system must satisfy below equation. stability criteria: esr ? cout > ton / 2 here, ton is constant on time. if the system cannot satisfy above equation, subharmonic oscillation will occur. vout setting fb comparator compares fb voltage and internal accurate reference voltage (0.8 v). feedback loop controls fb voltage to match the reference voltage. therefore, out put voltage is set by following equation. vout: 0.8 v ? (r1+r2) / r2 here, r1 and r2 is output voltage divider resister (refer to above figure). however, ripple voltage on fb pin affects fb voltage, so vout slightly shifts from setting value. if the system needs high accuracy, adjust vout by changing r1, r2 value. raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 12 of 17 nov 29, 2012 operating with small esr output capacitor when using low-esr output capacitor like mlcc, voltage ripple on output voltage node is very small. so voltage ripple needs to be enhanced by additional components. recommended ripple enhance method is like below figure. vout rf cf cr sw fb vin lout r1 r2 cout ripple injection on fb pin rf and cf make ripple voltage using inductor dcr ripple. cr is used for ac ripple injection to fb pin. ripple voltage between rf and cf is described by following equation. vripple: (vin ? vout) ? ton / (rf ? cf) make sure above ripple voltage is larger than 15 mv. stability criteria from loop stability analysis of abov e circuit configuration, the syst em must satisfy below equation. stability criteria: lout ? cout / (rf ? cf ) > ton / 2 if the system cannot satisfy above equation, subharmonic oscillation will occur. vout setting output voltage setting is basically same concept as high esr capacitor use case. ripple voltage from injection circuit affects fb voltage, so it need to be ad just r1, r2 for high accuracy system. raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 13 of 17 nov 29, 2012 board layout example (raa207700gbm) top layer (top view) inductor input cap. output cap. raa207700gbm vin plane gnd plane vout plane sw plane raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 14 of 17 nov 29, 2012 representative inductors maker inductance [ ? h] ? l/l0 = 20% change [a] dimensions [mm] 0.42 20.0 6.7 ? 8.0 ? 4.0 0.60 19.0 6.7 ? 8.0 ? 5.0 0.88 24.0 10.0 ? 11.5 ? 4.0 nec tokin mpc series 1.0 25.0 10.0 ? 11.7 ? 5.5 0.47 13.9 * 1 6.5 ? 7.4 ? 3.0 1.0 10 * 1 6.5 ? 7.4 ? 3.0 alps green device glmc series 1.5 8.8 * 1 6.5 ? 7.4 ? 3.0 0.33 15.9 6.7 ? 7.4 ? 3.0 0.47 15.6 6.7 ? 7.4 ? 3.0 0.75 10.9 6.7 ? 7.4 ? 3.0 toko fdve0630 series 1.0 9.5 6.7 ? 7.4 ? 3.0 0.35 14.9 5.0 ? 5.2 ? 3.0 0.47 11.0 5.0 ? 5.2 ? 3.0 tdk spm5030 series 0.75 9.7 5.0 ? 5.2 ? 3.0 note: * 1 30% change ? small size inductor for raa207702GBM maker inductance [ ? h] ? l/l0 = 30% change [a] dimensions [mm] 0.68 8.3 4.2 ? 4.2 ? 2.0 1.0 6.8 4.2 ? 4.2 ? 2.0 toko fdsd0420 series 1.5 5.7 4.2 ? 4.2 ? 2.0 0.47 8.3 4.4 ? 4.1 ? 1.2 tdk spm4012 series 1.0 4.8 4.4 ? 4.1 ? 1.2 representative output capacitors maker maximum voltage [v] capacitance [ ? f] sanyo poscap series 2.0 to 10 47 to 330 sanyo os-con series 2.0 to 10 47 to 330 murata mlcc series 6.3 to 10 22 to 47 tdk mlcc series 6.3 to 10 22 to 47 taiyo yuden mlcc series 6.3 to 10 22 to 47 raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 15 of 17 nov 29, 2012 package dimensions ? raa207700gbm 4 0.05 b b a c d e f 2 43 1 5 g a seating plane c area 0.08 s c area s 0.05 m s ab 35-0.320.05 2.67 0.05 0.335 0.05 2.0 0.5 0.5 0.33 3.34 0.67 0.67 0.5 0.5 0.5 0.335 0.05 3.87 0.05 0.265 0.05 0.235 0.04 0.4 0.04 0.265 0.05 raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 16 of 17 nov 29, 2012 ? raa207701gbm 4 0.05 b a c d e f a c area c area s 30-0.320.05 b 2 43 1 5 0.08 s 0.05 m s ab 2.67 0.05 0.335 0.05 0.335 0.05 2.0 0.5 0.5 0.08 0.5 0.5 3.37 0.05 0.265 0.05 0.235 0.04 0.4 0.04 2.84 0.67 0.67 0.265 0.05 seating plane raa207700gbm/7701gbm/7702GBM preliminary r07ds0891ej0001 rev.0.01 page 17 of 17 nov 29, 2012 ? raa207702GBM c area 4 0.05 c area s a b 20-0.320.05 a b c d 2 43 1 5 0.08 s 0.05 m s ab 2.67 0.05 0.335 0.05 0.335 0.05 2.0 0.5 0.25 2.37 0.05 0.5 0.265 0.05 0.235 0.04 0.4 0.04 1.84 0.67 0.67 0.265 0.05 seating plane notice 1. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of renesas electronics or others. 4. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of renesas electronics product. 5. renesas electronics products are classified according to the following two quality grades: "standard" and "high quality". t he recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. renesas electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). you must check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application for which it is not intended. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for which the product is not intended by renesas electronics. 6. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 7. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have s pecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatib ility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufactu re, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. you should not use renesas electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. when exporting the renesas electronics products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. it is the responsibility of the buyer or distributor of renesas electronics products, who distributes, disposes of, or othe rwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, renesas electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of renesas electronics products. 11. this document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of renesa s electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this doc ument or renesas electronics products, or if you have any other inquiries. (note 1) "renesas electronics" as used in this document means renesas electronics corporation and also includes its majority-o wned subsidiaries. (note 2) "renesas electronics product(s)" means any product developed or manufactured by or for renesas electronics. htt p ://www.renesas.co m refer to "htt p ://www.renesas.com/" for the latest and detailed information . r e n esas el ec tr o ni cs am e ri ca in c . 2880 scott boulevard santa clara , ca 95050-2554 , u.s.a . tel: +1-408-588-6000, fax: +1-408-588-6130 renesas electronics canada limited 1101 nicholson road, newmarket, ontario l3y 9c3, canada tel: +1-905-898-5441, fax: +1-905-898-3220 renesas electronics europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k tel: +44-1628-651-700, fax: +44-1628-651-804 renesas electronics europe gmbh arcadiastrasse 10, 40472 dsseldorf, germany tel: +49-211-65030, fax: +49-211-6503-1327 renesas electronics (china) co., ltd. 7th floor, quantum plaza, no.27 zhichunlu haidian district, beijing 100083, p.r.china tel: +86-10-8235-1155, fax: +86-10-8235-7679 renesas electronics (shanghai) co., ltd. unit 204, 205, azia center, no.1233 lujiazui ring rd., pudong district, shanghai 200120, china tel: +86-21-5877-1818, fax: +86-21-6887-7858 / -7898 renesas electronics hong kong limited unit 1601-1613, 16/f., tower 2, grand century place, 193 prince edward road west, mongkok, kowloon, hong kong tel: +852-2886-9318, fax: +852 2886-9022/9044 renesas electronics taiwan co., ltd. 13f, no. 363, fu shing north road, taipei, taiwan tel: +886-2-8175-9600, fax: +886 2-8175-9670 renesas electronics singapore pte. ltd. 80 bendemeer road, unit #06-02 hyflux innovation centre singapore 339949 tel: +65-6213-0200, fax: +65-6213-0300 renesas electronics mala y sia sdn.bhd. unit 906, block b, menara amcorp, amcorp trade centre, no. 18, jln persiaran barat, 46050 petalin g jaya, selan g or darul ehsan, malaysi a tel: +60-3-7955-9390 , fax: +60-3-7955-951 0 renesas electronics korea co. , ltd . 11f., samik lavied' or bld g ., 720-2 yeoksam-don g , kan g nam-ku, seoul 135-080, korea tel: +82-2-558-3737 , fax: +82-2-558-514 1 s ale s o ffi c e s ? 2012 renesas electronics corporation. all ri g hts reserved . colo p hon 2.2 |
Price & Availability of 7702GBM
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |